Electronic components package

Packaging has roughly gone through the following development process:

In terms of structure.

TO → DIP → PLCC → QFP → BGA → CSP.

In terms of materials. Metals, ceramics, ceramics, plastics, and plastics.

Pin shape. Long lead direct insertion → Short lead or no lead mounting → Ball shaped protrusions.

Assembly method. Through hole insertion → surface assembly → direct installation.

The following is an introduction to the specific packaging forms:

01

SOP/SOIC packaging

SOP is the abbreviation for Small Outline Package in English, which means Small Outline Package.

SOP encapsulation

SOP packaging technology was successfully developed by Philips Corporation from 1968 to 1969, and gradually evolved into:

SOJ, J-pin small form factor packaging

TSOP, Thin Small Form Factor Package

VSOP, very small form factor packaging

SSOP, scaled down SOP

TSSOP, Thin Reduced SOP

SOT, Small Form Factor Transistor

SOIC, Small Form Factor Integrated Circuit