Found in 2000. In May 2016, it was successfully listed in the national NEEQ stock market with the stock code "836879", referred to as "Mingde shares,and then estabish Guangdong sales office in Dongguan
Chip R & D Achievements
Ø Core Chip Core Chip
★ 2005 developed TVS chip manufacturing process 2005 developed TVS chip manufacturing process；
★ 2006 developed 2006 developed zzener ener chip manufacturing chip manufacturing proces process；
★ 2009 developed epitaxial technology to manufacture SF chip process 2009 developed epitaxial technology to manufacture SF chip process ；
★ 2010 developed epitaxial technology to manufacture DB3 chip process 2010 developed epitaxial technology to manufacture DB3 chip process
★ 2010 developed epitaxial technology to manufacture DB3 chip process 2010 developed epitaxial technology to manufacture DB3 chip process；
★ 2011 developed DU3 chip manufacturing 2011 developed DU3 chip manufacturing proces proces with patent rights with patent rights；
★ 2017 developed high power TVS chip 2017 developed high power TVS chip ； Ø Chip Advantages Chip Advantages
★ 20 years experience R&D team 20 years experience R&D team
★ TCAD TCAD computer analog technology
Package Achievements
★ 2007 2007 developed developed MSMA、SSODOD--123FL package products 123FL package products；
★ 2008 Invented 2008 Invented MMBFBF，holding patent holding patent ；
★ 2010 2010 developed RS developed RS--C2 Dual C2 Dual--core non core non--interconnect package interconnect package products products ；
★ 2013 developed more Dual 2013 developed more Dual--core non core non--interconnect package interconnect package
products products： SOF2 SOF2--44（ Subminiature Surface Mount Rectifier Bridge Subminiature Surface Mount Rectifier Bridge ）、
TOTO--277C、SIP2 SIP2--55（single phase bridge single phase bridge、 three phase bridge three phase bridge ）
★ 2016,developed SOD 2016,developed SOD--323 323 package products package products